JST Single Wafer Wet Process System
Ospray, a single wafer wet etcher, design and manufacture by JST
- Active gripping or passive spin chuck availabel
- Wafer rotation speed control from 1RPM to 3,000RPM
- Multiple spray arms
- up to 3 nozzles per spray arm
- Precisiondistance control between nozzle and substrate
- Synchronized Programable servo controlled oscillating spray nozzles
- Ability for non-linear spray arm velocity profile across the wafer surface for improveed
uniformity
- Programable chemical flow rate and process control
- Single pas or chemical reciculation availabel